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Flexible Electronics News

2016 FLEX Europe Issues Call for Papers

Silicon electronics + flexible systems enabling new markets.

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By: DAVID SAVASTANO

Contributing Editor, Coatings World and Ink World, Coatings World and Ink World Magazine

End users, supply chain companies, R&D organizations, and universities are invited to submit abstracts for the 2016 FLEX Europe Conference (formerly the Plastic Electronics Conference). This two-day conference, an integral part of SEMICON Europa 2016, will address materials, manufacturing, and applications for flexible hybrid electronics (FHE) and printed electronics (PE).
 
The integration of silicon semiconductor devices onto flexible substrates enables a whole new class of electronics. Markets impacted include structural health monitoring, the Internet of Things (IOT), and medical devices, among others. Specific applications include wearable electronics, smart packaging, smart sensor systems, and nano-bio devices.
 
Please submit your abstracts, biography and a photo via internet by April 29, 2016. Abstracts submitted via fax, e-mail, post, or other methods will generally not be accepted. The conference language is English.
 
The abstract should have between 1,000 and 2,000 characters, starting with descriptive paragraph identifying issue addressed and solution. Abstract changes and corrections will be accepted until April 29, 2016.
 
Your presentation may not be included in the review process unless the information is complete.
 
Evaluation criteria include significance, usefulness for the manufacturing world and clarity and accuracy as a paper. Abstracts will be peer-reviewed. We encourage application related presentations, i.e., on joint projects between users and suppliers. Papers are to be non-commercial and focus on the technical/economical merits of a process rather than the individual company’s product benefits. Selected presenters will be notified by July 19, 2016.

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